APSUNY工艺设计套件(PDKv3.0):在300mm晶圆上的O, C和L波段硅光子元件库

2019 Optical Fiber Communications Conference and Exhibition (OFC) Pub Date : 2019-03-03 DOI:10.1364/OFC.2019.TU2A.1

E. Timurdogan, Z. Su, R. Shiue, C. Poulton, M. Byrd, Simon Xin, M. Watts

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引用次数: 24

摘要

更新的工艺设计套件(APSUNY PDKv3.0)引入了经过验证的无源和有源O+C+L波段硅光子元件库，其中包括50Gbaud (100Gbps)能力的调制器，300mm SOI晶圆上的高产量分路器和检测器。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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APSUNY Process Design Kit (PDKv3.0): O, C and L Band Silicon Photonics Component Libraries on 300mm Wafers

An updated process design kit (APSUNY PDKv3.0) is introduced with verified passive and active O+C+L band silicon photonics component libraries, which includes 50Gbaud (100Gbps) capable modulators, high yield splitters and detectors on 300mm SOI wafers.

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2019 Optical Fiber Communications Conference and Exhibition (OFC)

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