用升级的ALICE内部跟踪系统测量Pb-Pb碰撞中的重味

D. Andreou
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摘要

在LHC第二次长时间关闭(LS2)期间,ALICE(大型离子对撞机实验)的内部跟踪系统(ITS)将被7层CMOS单片有源像素传感器(MAPS)所取代。硅成像技术的最新创新允许建造大型超薄硅晶片,这可以进一步提高ALICE跟踪器的能力。一种新型顶点检测器的研制工作已经开始。提出了第三次LS3长停堆(LS3)的探测器安装方案,在此期间,最内层的三层将被三个圆柱形的大弯曲CMOS晶圆所取代。此次升级(ITS3)将进一步提高撞击参数的分辨率和低动量粒子的跟踪效率。最内层将被放置在更靠近交互点的位置,并且材料预算将减少到每层0.05$\%X_0$。在ITS2设计中简化ITS3几何结构的蒙特卡罗模拟表明,ITS2在冲击参数分辨率和跟踪效率方面有所提高,这对重味强子的测量至关重要。这一贡献显示了$\Lambda_{\mathrm{b}}$示例的性能改进,该示例的测量意义是基于这些MC模拟提取的。与ITS2相比,在低动量区观察到几乎三倍的显著改进。
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Heavy-flavour Measurements in Pb–Pb Collisions with the Upgraded ALICE Inner Tracking System
During the second LHC long shutdown (LS2) the Inner Tracking System (ITS) of ALICE (A Large Ion Collider Experiment) will be replaced by seven layers of CMOS Monolithic Active Pixel Sensors (MAPS). The latest innovations in silicon imaging technology allow for the construction of large, ultra-thin silicon wafers which can further improve the capabilities of the ALICE tracker. The research and development studies towards the construction of a novel vertex detector have started. The detector installation has been proposed for the third LHC long shutdown (LS3) during which the three innermost layers shall be replaced by three cylindrical layers of large curved CMOS wafers. This upgrade (ITS3) will further improve the impact parameter resolution and the tracking efficiency of low momentum particles. The innermost layer will be positioned closer to the interaction point and the material budget will be reduced down to 0.05$\%X_0$ per layer. Monte Carlo simulations of a simplified ITS3 geometry within the ITS2 design indicate an improvement in the impact parameter resolution and the tracking efficiency, which are of crucial importance for measurements of heavy-flavour hadrons. This contribution shows the improved performance for the example of the $\Lambda_{\mathrm{b}}$, for which the significance of its measurement is extracted based on these MC simulations. A significant improvement by almost a factor of three in the low momentum region compared to the ITS2 is observed.
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