热冲击载荷下镍基高温合金裂纹扩展行为研究

IF 1.7 4区 材料科学 Q3 MATERIALS SCIENCE, MULTIDISCIPLINARY Materials Science and Technology Pub Date : 2023-05-04 DOI:10.1080/02670836.2022.2154932
X. Niu, Rutao Zhao, Zhigang Sun, Yingdong Song, Yaning Chang
{"title":"热冲击载荷下镍基高温合金裂纹扩展行为研究","authors":"X. Niu, Rutao Zhao, Zhigang Sun, Yingdong Song, Yaning Chang","doi":"10.1080/02670836.2022.2154932","DOIUrl":null,"url":null,"abstract":"In this paper, the crack initiation and propagation laws of GH4169 under thermal-shock load were investigated. It was found that the development of main cracks experienced three stages: accelerated growth in the small crack stage, decelerated growth in the long crack stage and finally discontinued growth. With the increase of temperature, the crack initiation life decreases and the propagation rate increases, the crack initiation life at 600°C is six times to that at 700°C. A thermal fatigue crack growth model was proposed to character the whole crack growth process, and a comparison was drawn with the Paris and Z-H model. The results show that the model is applicable to predict the whole process growth rate of thermal fatigue cracks.","PeriodicalId":18232,"journal":{"name":"Materials Science and Technology","volume":"43 1","pages":"1171 - 1179"},"PeriodicalIF":1.7000,"publicationDate":"2023-05-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Research on crack propagation behaviour of nickel-based superalloy under thermal shock load\",\"authors\":\"X. Niu, Rutao Zhao, Zhigang Sun, Yingdong Song, Yaning Chang\",\"doi\":\"10.1080/02670836.2022.2154932\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, the crack initiation and propagation laws of GH4169 under thermal-shock load were investigated. It was found that the development of main cracks experienced three stages: accelerated growth in the small crack stage, decelerated growth in the long crack stage and finally discontinued growth. With the increase of temperature, the crack initiation life decreases and the propagation rate increases, the crack initiation life at 600°C is six times to that at 700°C. A thermal fatigue crack growth model was proposed to character the whole crack growth process, and a comparison was drawn with the Paris and Z-H model. The results show that the model is applicable to predict the whole process growth rate of thermal fatigue cracks.\",\"PeriodicalId\":18232,\"journal\":{\"name\":\"Materials Science and Technology\",\"volume\":\"43 1\",\"pages\":\"1171 - 1179\"},\"PeriodicalIF\":1.7000,\"publicationDate\":\"2023-05-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Materials Science and Technology\",\"FirstCategoryId\":\"88\",\"ListUrlMain\":\"https://doi.org/10.1080/02670836.2022.2154932\",\"RegionNum\":4,\"RegionCategory\":\"材料科学\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q3\",\"JCRName\":\"MATERIALS SCIENCE, MULTIDISCIPLINARY\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Science and Technology","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1080/02670836.2022.2154932","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

摘要

研究了GH4169在热冲击载荷作用下的裂纹萌生和扩展规律。研究发现,主裂纹的发展经历了三个阶段:小裂纹阶段加速扩展,长裂纹阶段减速扩展,最后停止扩展。随着温度的升高,裂纹起裂寿命减小,扩展速率增大,600℃时的裂纹起裂寿命是700℃时的6倍。提出了表征裂纹扩展全过程的热疲劳裂纹扩展模型,并与Paris模型和Z-H模型进行了比较。结果表明,该模型可用于预测热疲劳裂纹的全过程扩展速率。
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Research on crack propagation behaviour of nickel-based superalloy under thermal shock load
In this paper, the crack initiation and propagation laws of GH4169 under thermal-shock load were investigated. It was found that the development of main cracks experienced three stages: accelerated growth in the small crack stage, decelerated growth in the long crack stage and finally discontinued growth. With the increase of temperature, the crack initiation life decreases and the propagation rate increases, the crack initiation life at 600°C is six times to that at 700°C. A thermal fatigue crack growth model was proposed to character the whole crack growth process, and a comparison was drawn with the Paris and Z-H model. The results show that the model is applicable to predict the whole process growth rate of thermal fatigue cracks.
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来源期刊
Materials Science and Technology
Materials Science and Technology 工程技术-材料科学:综合
CiteScore
2.70
自引率
5.60%
发文量
0
审稿时长
3 months
期刊介绍: 《Materials Science and Technology》(MST) is an international forum for the publication of refereed contributions covering fundamental and technological aspects of materials science and engineering.
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