{"title":"负离子溅射过程中的各向异性蚀刻","authors":"Russell Messier, Daniel J. Kester","doi":"10.1016/0378-5963(85)90042-X","DOIUrl":null,"url":null,"abstract":"<div><p>Negative ion resputtering leads to a nonuniform erosion of material which can result in a wide range of morphological features. These various surface structures are a consequence of focused bombardment processes which are highly sensitive to sputtering system geometry and preparation parameters. The continuous manner in which the features are connected leads to a clearer understanding of each.</p></div>","PeriodicalId":100105,"journal":{"name":"Applications of Surface Science","volume":"22 ","pages":"Pages 111-117"},"PeriodicalIF":0.0000,"publicationDate":"1985-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0378-5963(85)90042-X","citationCount":"1","resultStr":"{\"title\":\"Anisotropic etching during negative ion resputtering\",\"authors\":\"Russell Messier, Daniel J. Kester\",\"doi\":\"10.1016/0378-5963(85)90042-X\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>Negative ion resputtering leads to a nonuniform erosion of material which can result in a wide range of morphological features. These various surface structures are a consequence of focused bombardment processes which are highly sensitive to sputtering system geometry and preparation parameters. The continuous manner in which the features are connected leads to a clearer understanding of each.</p></div>\",\"PeriodicalId\":100105,\"journal\":{\"name\":\"Applications of Surface Science\",\"volume\":\"22 \",\"pages\":\"Pages 111-117\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1985-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1016/0378-5963(85)90042-X\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Applications of Surface Science\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/037859638590042X\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Applications of Surface Science","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/037859638590042X","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Anisotropic etching during negative ion resputtering
Negative ion resputtering leads to a nonuniform erosion of material which can result in a wide range of morphological features. These various surface structures are a consequence of focused bombardment processes which are highly sensitive to sputtering system geometry and preparation parameters. The continuous manner in which the features are connected leads to a clearer understanding of each.