用四点探针法研究和计算银薄层的电性能

Askari Mb, M. Shahryari, S. Nanekarany
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引用次数: 4

摘要

本研究采用热蒸发法在硅p型衬底上制备了晶体取向分别为100、300、360和400 nm的银薄层。采用四点探针和x射线衍射(XRD)分析了表层的电学性能,包括片电阻、电导率、电阻率和银相形成情况。结果表明,在400 nm处,银的晶向为200的FCC(面-中心立方)结构达到最佳状态,由Deby-Scherrer公式计算出连续板间的距离为8.94 nm。四点表明,随着厚度的增加,片材电阻率和电阻率减小,电导增大。在厚度为400 nm时,银层的电导率最高,电阻最低。
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Study and Calculation Electrical Properties of Silver Thin Layers by Four-Point Probe Method
In this research Ag thin layers on silicon p-type substrate with crystal orientation (100) and 300, 360 and 400 nm thicknesses by thermal evaporation was deposited. Four-point probe and XRD analysis of surface layers consequently for study electrical properties included of sheet resistance, conductivity, resistivity and investigation of Ag phase formed, was done. As result XRD was shown that at 400 nm the best state of silver face-central cubic (FCC) structure with crystal orientation (200) was formed and by Deby-Scherrer formula distance between successive plates was calculated 8.94 nm. Four-point illustrated that sheet resistance and electrical resistivity with increase thickness, decreases while conductance increases. At 400 nm thickness Ag layer has the most conductivity and the lowest resistance.
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