用总电子产率和x射线反射率技术表征Mo/Si多层材料的表层

M. Sinha, M. Modi
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引用次数: 0

摘要

在x射线多层材料中,顶层的厚度对其反射率有重要影响。在实验生长的多层材料中,由于生长相关问题和污染效应,表层参数与下层参数存在显著差异。计算表明,对于顶层表征,反射率技术的灵敏度取决于层的材料。考虑到顶层硅,Mo/Si多层膜的第一个Bragg峰反射率变化了2-3%,而顶层厚度变化了2倍以上,当顶层材料为SiO2时,第一个Bragg峰反射率变化了13%。总电子产额(TEY)数据分析表明,该技术可用于探测顶层厚度的2-4 A变化。这两种技术-反射率和TEY -一起给出了多层结构参数的完整信息。
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Characterization of Surface Layer in Mo/Si Multilayer Using TotalElectron Yield and X-ray Reflectivity Techniques
In x-ray multilayer, the thickness of top layer plays an important role in determining its reflectivity performance. In experimentally grown multilayer, the top layer parameters are found significantly different from those of underneath layers due to growth related issues and contamination effect. The calculations suggest that for top layer characterization the sensitivity of reflectivity technique depends on layer material. Considering the top layer of silicon the first Bragg peak reflectivity of Mo/Si multilayer changes by 2-3% while change in top layer thickness by a factor of two and more, In case of SiO2 as a top layer material the 1st Bragg peak reflectivity changes by 13%. The analysis of total electron yield (TEY) data reveals that the technique can be used to probe 2-4 A variation in top layer thickness. The both technique-reflectivity and TEY, together gives an complete information of multilayer structural parameters.
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