多晶铜在静压挤压过程中的结构和强度,还原系数高达R = 100

W. Pachla, L. Styczynski
{"title":"多晶铜在静压挤压过程中的结构和强度,还原系数高达R = 100","authors":"W. Pachla, L. Styczynski","doi":"10.1179/030634584790420311","DOIUrl":null,"url":null,"abstract":"AbstractThe effect of extrusion ratios in the range 60–100 on the structure and strength of cold hydrostatically extruded. copper of 99.9% purity are reviewed. The final structure is mainly formed as a result of dynamic and static recrystallization and is controlled directly by the temperature generated in the die and the cooling rate at the die exit. Because of the high thermal effect of the process (T/T m … 0.54), products air cooled are fully recrystallized, the process having no dependence on the value of extrusion ratio used but being a result of the high efficiency of postdynamic recrystallization and secondary grain growth. It is possible to prevent static effects by instantaneous quenching of the extruded wire. Quenched products have microstructures in various stages of plastic deformation. Plots of 0.2% proof stress and elongation v. extrusion ratio exhibit two maxima which are a result of interaction between dynamic recrystallization and strain hardening. Above an extrusion ratio of about 90, th...","PeriodicalId":18750,"journal":{"name":"Metal science","volume":"72 1","pages":"22-26"},"PeriodicalIF":0.0000,"publicationDate":"1984-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Structure and strength of polycrystalline copper during hydrostatic extrusion with reduction up to R = 100\",\"authors\":\"W. Pachla, L. Styczynski\",\"doi\":\"10.1179/030634584790420311\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"AbstractThe effect of extrusion ratios in the range 60–100 on the structure and strength of cold hydrostatically extruded. copper of 99.9% purity are reviewed. The final structure is mainly formed as a result of dynamic and static recrystallization and is controlled directly by the temperature generated in the die and the cooling rate at the die exit. Because of the high thermal effect of the process (T/T m … 0.54), products air cooled are fully recrystallized, the process having no dependence on the value of extrusion ratio used but being a result of the high efficiency of postdynamic recrystallization and secondary grain growth. It is possible to prevent static effects by instantaneous quenching of the extruded wire. Quenched products have microstructures in various stages of plastic deformation. Plots of 0.2% proof stress and elongation v. extrusion ratio exhibit two maxima which are a result of interaction between dynamic recrystallization and strain hardening. Above an extrusion ratio of about 90, th...\",\"PeriodicalId\":18750,\"journal\":{\"name\":\"Metal science\",\"volume\":\"72 1\",\"pages\":\"22-26\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1984-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Metal science\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1179/030634584790420311\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Metal science","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1179/030634584790420311","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

摘要研究了挤压比在60 ~ 100范围内对冷静压挤压件结构和强度的影响。对纯度为99.9%的铜进行了审查。最终的组织主要是动态和静态再结晶的结果,并由模具内产生的温度和模具出口的冷却速度直接控制。由于该工艺的热效应高(T/T m…0.54),风冷后的产品完全再结晶,该工艺不依赖于所用挤压比的值,而是后动态再结晶和二次晶粒生长效率高的结果。通过对挤出的线材进行瞬时淬火,可以防止静电效应。淬火后的制品在塑性变形的各个阶段都有显微组织。在0.2%的抗应力和伸长率与挤压比图中,动态再结晶和应变硬化相互作用的结果显示出两个最大值。在挤压比约为90以上时,…
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Structure and strength of polycrystalline copper during hydrostatic extrusion with reduction up to R = 100
AbstractThe effect of extrusion ratios in the range 60–100 on the structure and strength of cold hydrostatically extruded. copper of 99.9% purity are reviewed. The final structure is mainly formed as a result of dynamic and static recrystallization and is controlled directly by the temperature generated in the die and the cooling rate at the die exit. Because of the high thermal effect of the process (T/T m … 0.54), products air cooled are fully recrystallized, the process having no dependence on the value of extrusion ratio used but being a result of the high efficiency of postdynamic recrystallization and secondary grain growth. It is possible to prevent static effects by instantaneous quenching of the extruded wire. Quenched products have microstructures in various stages of plastic deformation. Plots of 0.2% proof stress and elongation v. extrusion ratio exhibit two maxima which are a result of interaction between dynamic recrystallization and strain hardening. Above an extrusion ratio of about 90, th...
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