带式铸造多层器件用BaTiO3薄膜

S. Ivanchenko, S. Umerova, D. Baranovskyi, O. Kovalenko, A. Ragulya
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引用次数: 0

摘要

现代印刷电子应用范围的多样性无情地要求在减小器件整体尺寸的同时提高操作性能。克服这一主要障碍的最有效方法之一是减少相对于器件尺寸的功能层厚度。在这篇文章中,我们讨论了一种简单的实现小型化概念的方法,通过应用一种众所周知的高效率的工业方法——胶带铸造,来获得基于BaTiO3纳米粉末的薄纳米结构陶瓷层,用于MLCC。使用纳米级粉末本身就意味着开发具有合适流变性的悬浮液的新方法。我们证明了聚合物分子的长度决定了絮凝体的大小,从而影响了带铸膜的厚度和表面质量。一定的纳米粉末/聚合物比例有助于形成表面粗糙度与一个纳米颗粒(20-25纳米)大小相当的带。此外,已确定的悬浮液对温度变化极为敏感。降低温度会显著影响悬浮液的流动特性,从而影响铸带的厚度。考虑到这一事实,我们提出了一种有效的自主研发的纳米粉末悬浮铸造预冷方法,该方法可以通过带铸造方法获得厚度小于1 μ m,表面粗糙度为20-25 nm的极薄光滑带。
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BaTiO3 films for multilayer devices by tape casting
The diversity of the applicational scope of modern printed electronics relentlessly requires the improvement of operational properties simultaneously with reducing the overall dimensions of devices. One of the most effective ways to overcome this major obstacle is the reduction of functional layers thickness in respect to the size of the device. In the present article, we are discussing a simple way of practical implementation of miniaturization concept through the application of a well-known high-productive industrial method of tape casting for obtaining thin nanostructured ceramic layers based on BaTiO3 nanopowders for MLCC. Using of nanosized powders per se imply a new approach of developing suspensions with suitable rheology for tape casting. We demonstrate, that a length of polymer molecule defines the size of floccules and therefore influences the thickness and surface quality of tape casted films. A certain nanopowder/polymer ratio contributes to the formation of the tapes with the surface roughness comparable with the size of one nanoparticle (20-25 nm). Moreover, it was established that developed suspensions are extremely sensitive to temperature changes. Lowering the temperature significantly affects the flow character of suspension and thus the thickness of casted tapes. Considering this fact, we propose an effective self-developed pre-cooling method of nanopowder suspension casting, which allows obtaining extremely thin and smooth tapes with a thickness of less than 1 µm and surface roughness of 20–25 nm by tape casting method.
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