SEM alloyedGe在既ohmic接触GaAs摄氏度

A.G. Nassibian, T.S. Kalkur
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引用次数: 3

摘要

用商用扫描电镜扫描电子束对n型砷化镓上真空蒸发AuGeNi触点进行局部合金化。研究了在金属化厚度450 ~ 1350 Å范围内,电炉和电子束合金触点的接触质量。对于电子束合金化方法,接触电阻率随金属化厚度的增加而减小,当金属化厚度大于750时保持恒定Å。扫描电镜和电子探针分析表明,电子束合金触点比炉合金触点发生较少的触点成分重分布。触点的稳定性由高温老化决定。
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SEM alloyed AuGeNi ohmic contacts to GaAs

A scanned electron beam from a commercial SEM is used for the localized alloying of vacuum evaporated AuGeNi contacts on n-type GaAs. The contact quality is studied for metallization thickness, 450–1350 Å, for furnace and electron beam alloyed contacts. For the electron beam alloyed method, the contact resistivity decreases with increasing metallization thickness and remains constant for thicknesses above 750 Å. Scanning electron microscopy and electron microprobe analysis shows that electron beam alloyed contacts undergo less redistribution of contact constituents than furnace alloyed contacts. The stability of the contacts is determined by high temperature ageing.

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