设计低功耗电子产品静电放电保护解决方案的挑战

J. Liou
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引用次数: 1

摘要

静电放电(ESD)是将有限数量的电荷从一个物体(即人体)转移到另一个物体(即微芯片)的过程。这个过程可以导致在很短的时间内通过物体的非常大的电流[1-2]。当微芯片或电子系统遭受ESD事件时,如果物体产生的热量不能迅速消散,则巨大的ESD感应电流可能会损坏微芯片并导致电子系统故障。据估计,所有损坏的微芯片中约有35%与ESD有关,导致全球半导体行业每年损失数亿美元的收入。随着MOS器件尺寸的不断缩小,ESD引起的故障更加突出,可以肯定地预测,有效和强大的ESD保护解决方案的可用性将成为成功开发基于cmos的集成电路的关键因素[4-7]。
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Challenges on designing electrostatic discharge protection solutions for low power electronics
Electrostatic discharge (ESD) is a process in which a finite amount of charge is transferred from one object (i.e., human body) to the other (i.e., microchip). This process can result in a very high current passing through the object within a very short period of time [1-2]. When a microchip or electronic system is subject to an ESD event, the huge ESD-induced current can likely damage the microchip and cause malfunction to the electronic system if the heat generated in the object cannot be dissipated quickly enough. It is estimated that about 35% of all damaged microchips are ESD related, resulting in a revenue loss of several hundred million dollars in the global semiconductor industry every year [3]. The continuing diminishing in the size of MOS devices makes the ESD-induced failures even more prominent, and one can predict with certainty that the availability of effective and robust ESD protection solutions will become a critical component to the successful development of the CMOS-based integrated circuits [4-7].
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