常压冷等离子体在霉菌灭活中的应用

P. Tichá, M. Domonkos, Z. Racova, P. Demo
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引用次数: 0

摘要

霉菌在室内的生长是一个日益严重的问题,对居住者和建筑材料都有不利影响。本研究的目的是提出一种新的环境友好型方法(冷大气等离子体处理),用于去除霉菌孢子污染的室内环境,有可能成为传统方法的有效替代,如紫外线- c (UV-C)杀菌照射。将麦芽浸膏琼脂平板上的曲霉孢子暴露于弥漫性共面表面阻挡放电产生的等离子体中。利用图像分析对模具表面覆盖度进行了评价。冷等离子体处理在0.5分钟内使培养基表面的孢子灭活,而在UV-C照射30分钟后观察到微弱的生长延迟。本研究表明,与杀菌紫外- c照射相比,低温常压等离子体是一种更有效的方法来减少琼脂上的霉菌孢子。
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Application of cold atmospheric plasma for mold inactivation
Mold growth in indoor interiors is an increasing problem that has adverse effects on both occupants and building materials. The aim of this study was to present the new environmentally friendly method (cold atmospheric plasma treatment) for decontamination of indoor environments contaminated by mold spores, with the potential to become an effective replacement for conventional methods, such as ultraviolet-C (UV-C) germicidal irradiation. The spores of Aspergillus species on malt extract agar plates were exposed to plasma produced by diffuse coplanar surface barrier discharge. The surface coverage of mold was evaluated using image analysis. Cold plasma treatment inactivated spores on the surface of the culture medium in 0.5 min, whereas a weak growth delay was observed after 30 minute exposure to UV-C irradiation. This study demonstrated that cold atmospheric plasma is a more effective method for reducing mold spores on agar compared with germicidal UV-C irradiation.
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