生成适合于玻璃聚合物分子动力学研究的初始构型的新方法

T.M Madkour , O.I Mohammed, A.H Ebaid
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引用次数: 4

摘要

适合分子动力学运行的初始构型通常是根据分子扭角的随机值组装的,因此代表了不现实的聚合物链构象。一般来说,如果允许系统运行足够长的时间,使分子完全放松,这是可以接受的。然而,在目前的分子动力学运行状态下,3d周期系统通常允许运行100ps,这对于聚合物系统来说太短而无法放松。另外,传统的旋转异构体状态近似(RIS)可以用来生成聚合链的初始构型。不幸的是,RIS并没有考虑到组成聚合链的原子之间可能的段-段重叠。在这项工作中,我们研究了使用旋转异构状态近似来正确构建3d周期系统初始构型的可能性,而不允许任何段-段重叠。为了确保这些构型真实地代表了聚合物体系,我们尝试用实验确定的构型特性来测试这些体系的构型特性。此外,这些构型被用来进行后续的分子动力学运行,以阐明聚氯乙烯的分子量和温度对一些重要的热力学性质的影响,如自扩散系数、热压系数、热容和介电常数。
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New approach for the generation of initial configurations suitable for molecular dynamics studies of glassy polymers

Initial configurations suitable for molecular dynamics runs are usually assembled according to random values for the torsional angles of the molecules, and thus representing unrealistic conformations of the polymeric chains. In general, this would be acceptable if the system is allowed to run for periods of time long enough for the molecule to fully relax. However, in the current state of molecular dynamics runs, the 3D-periodic systems are usually allowed to run for 100 ps, which is too short for the polymeric system to relax. Alternatively, traditional rotational isomeric state approximation (RIS) could be used to generate the initial configurations of the polymeric chains. Unfortunately, RIS does not take into account the possible segment–segment overlap between atoms comprising the polymeric chains. In this work, we investigate the possibility of using the rotational isomeric state approximation to properly construct the initial configuration of 3D-periodic systems, without allowing any segment–segment overlap. In order to ensure that these configurations represent realistically the polymeric system, attempts were made to test the configurational properties of these systems against those determined experimentally. Further, these configurations were used to perform subsequent molecular dynamics runs in order to elucidate the effect of the molecular weight of poly(vinyl chloride) and temperature on some of the important thermodynamic properties such as self-diffusion coefficient, thermal pressure coefficient, heat capacity and dielectric constant.

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