Research on Novel Thermal Insulation Structure of CMOS-MEMS Thermopile

In this research, we discuss and analyze the thermal insulation microstructure which appropriately reduce the thermal conductivity and form a local channel where the heat flow is concentrated. As the channel becomes smaller, the thermal resistance increases and the noise will also increase. For the Johnson noise, the bandwidth can be reduced through subsequent electronic circuit signal processing. Although the response speed is sacrificed, the overall thermal sensing signal is improved in practical applications without introducing additional noise.