{"title":"直接结合:回顾与展望","authors":"Jan Haisma","doi":"10.1016/0165-5817(95)82010-8","DOIUrl":null,"url":null,"abstract":"<div><p>The characteristic features of direct bonding with respect to its many-sided aspects are briefly enumerated. Nowadays silicon-on-silicon and silicon-on-insulator are the trendsetters. The preparative conditions of direct bonding are compatible with silicon technologies. In addition, in the future, direct bonding may find dedicated applications in the field of hybrid material combinations, micromechanics for precision medical tools, sensors and actuators.</p></div>","PeriodicalId":101018,"journal":{"name":"Philips Journal of Research","volume":"49 1","pages":"Pages 171-177"},"PeriodicalIF":0.0000,"publicationDate":"1995-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1016/0165-5817(95)82010-8","citationCount":"3","resultStr":"{\"title\":\"Direct bonding: retrospect and outlook\",\"authors\":\"Jan Haisma\",\"doi\":\"10.1016/0165-5817(95)82010-8\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"<div><p>The characteristic features of direct bonding with respect to its many-sided aspects are briefly enumerated. Nowadays silicon-on-silicon and silicon-on-insulator are the trendsetters. The preparative conditions of direct bonding are compatible with silicon technologies. In addition, in the future, direct bonding may find dedicated applications in the field of hybrid material combinations, micromechanics for precision medical tools, sensors and actuators.</p></div>\",\"PeriodicalId\":101018,\"journal\":{\"name\":\"Philips Journal of Research\",\"volume\":\"49 1\",\"pages\":\"Pages 171-177\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1016/0165-5817(95)82010-8\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Philips Journal of Research\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://www.sciencedirect.com/science/article/pii/0165581795820108\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Philips Journal of Research","FirstCategoryId":"1085","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/0165581795820108","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The characteristic features of direct bonding with respect to its many-sided aspects are briefly enumerated. Nowadays silicon-on-silicon and silicon-on-insulator are the trendsetters. The preparative conditions of direct bonding are compatible with silicon technologies. In addition, in the future, direct bonding may find dedicated applications in the field of hybrid material combinations, micromechanics for precision medical tools, sensors and actuators.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
