镍磷电镀层的带状结构

C.C. Nee, R. Weil
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引用次数: 26

摘要

研究了平行于表面的暗层和亮层交替形成的Ni-P镀层的金相抛光和蚀刻截面上的带状结构。暗带是由于腐蚀剂在沉积物中磷含量随厚度变化相对突然的位置的电侵蚀造成的。提出了组分变化发生的机理。脉冲镀消除了带状组织,但对断裂强度和塑性影响不大。
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The banded structure of Ni-P electrodeposits

The banded structure observed in metallographically polished and etched cross sections of Ni-P electrodeposits consisting of alternate dark and light layers parallel to the surface was investigated. The dark bands were attributed to a galvanic attack by the etchant at locations where the phosphorus content of the deposit changed relatively abruptly with thickness. A mechanism for the development of the compositional changes is proposed. Pulsed plating was found to eliminate the banded structure, but had little effect on the fracture strength and ductility.

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