T. Nakao, M. Kadota, K. Nishiyama, Y. Nakai, D. Yamamoto, Y. Ishiura, T. Komura, N. Takada, R. Kita
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P2H-5 Small 3x2.5mm² Sized Surface Acoustic Wave Duplexer for US-PCS with Excellent Temperature and Frequency Characteristics
Using flattened-SiO2/Cu-electrode/36~48deg LiTaO3 structure, small size (5 x5mm2) surface acoustic wave (SAW) duplexer with a good temperature coefficient of frequency (TCF) for US-PCS was realized by authors. However, a smaller duplexer has been strongly required. Using flip-chip bonding process of SAW chips and Rayleigh SAW propagating on the flattened-SiO2/Cu- electrode/126~128degYX-LiNbO3, which has larger cou pling factor than above-mentioned substrate, a smaller sized (3x2.5mm2) SAW duplexer with a good TCF has been realized.
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