Electromagnetic simulation of passive ICs

This paper describes the outline of a method for simulating the electromagnetic behaviour of ICs fabricated in the RF passive integration process. The theory is an extension of that used in the CAD package Fasterix. This is modified to take account of the losses and other aspects of the IC process. The new theory is then applied to the design of a power amplifier for a mobile phone handset, and the results presented demonstrate its accuracy, speed and flexibility. Further results demonstrate that use of this powerful new model can lead to improved electrical performance of real RF applications.