现代Chokhralsky法所得锑化铟单晶在几个晶体学方向上的研究

N. Y. Komarovsky, E. V. Molodtsova, A. Belov, M. Grishechkin, R. Kozlov, S. S. Kormilitsina, E. Zhuravlev, M. S. Nestyurkin
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摘要

单晶锑化铟InSb是光电子、奈米电子学等固态电子学分支中不可或缺的材料。反过来,位错密度及其分布特征直接取决于生长过程的工艺参数,在很大程度上决定了材料的物理力学性能。我们介绍了用现代Czochralski方法在晶体学方向上研究InSb单晶的结果[100]、[111]和[112]。分析了生长条件(结晶前沿轴向和径向温度梯度)对InSb板位错结构和结构性能的影响。采用选择性刻蚀的方法表明,不同取向晶圆上的刻蚀坑数相差约一个数量级(平面(111)为103 cm-2,平面(100)为102 cm-2)。(100)平面的蚀刻坑的数量与它们在[112]和[100]方向上生长的晶体中的数量相称。可能InSb单晶中最大位错密度可以看作是一个材料常数,在结晶前沿沿较低轴向梯度生长的单晶强度的增加与通过扩散沿位错线形成一个特征的点缺陷系综有关。结果表明,InSb晶圆[112](100)具有最佳的物理和机械性能。所得结果可用于光电探测器结构的制造,特别是板材加工(切割、研磨和抛光),以优化工艺流程。
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Study of indium antimonide single crystals obtained by the modernized Chokhralsky method in several crystallographic directions
Single-crystal indium antimonide InSb is an indispensable material in such branches of solid-state electronics as opto- and nanoelectronics. In turn, the dislocation density and the character of their distribution, which directly depend on the technological parameters of the growth process, considerably determine the physical and mechanical properties of the material. We present the results of studying InSb single crystals obtained by the modernized Czochralski method in the crystallographic directions [100], [111], and [112]. The effect of growth conditions (axial and radial temperature gradients at the crystallization front) on the dislocation structure of InSb plates and the structural properties of the plates were analyzed. Using the method of selective etching it was shown that the number of etching pits on the wafers with different orientations differs by approximately an order of magnitude (103 cm–2 for plane (111) and 102 cm–2 for (100)). Number of etch pits for the (100) plane is commensurate with their number in crystals grown in the [112] and [100] directions. Probably, the maximum dislocation density in InSb single crystals can be considered as a material constant, and the increased strength of single crystals grown at lower axial gradients at the crystallization front is related to the formation of a characteristic ensemble of point defects along the dislocation line through diffusion. It is shown that InSb wafers [112] (100) exhibit the best physical and mechanical properties. The results obtained can be used in the manufacture of structures for photodetectors, in particular, in plate processing (cutting, grinding and polishing) to optimize technological processes.
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