一步DcMS和HiPIMS溅射从第四元靶CIGS薄膜

Rachid Oubaki, Karima Machkih, H. Larhlimi, O. Abegunde, J. Alami, M. Makha
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引用次数: 0

摘要

以四元化合物为靶材,采用一步、无硒化直流磁控溅射(DcMS)和高功率脉冲磁控溅射(HiPIMS)法制备了Cu(In,Ga)Se2薄膜。我们研究了溅射功率对薄膜的组成、微观结构、形貌和电学特性的影响。发现薄膜的结晶度受溅射功率的影响。在0.25 kW下沉积的薄膜是无定形的,而在0.5-1 kW下形成的薄膜则显示出(112)优先取向的黄铜矿结构。随着溅射功率的增加,薄膜的晶体质量得到改善,形貌均匀致密,无剥落和开裂。对CIGS薄膜的元素测量表明,根据沉积方法的不同,薄膜的成分与目标的成分有所偏离。随着溅射功率的增加,镀层的电学性能发生了变化。这篇文章受版权保护。版权所有。
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One‐step DcMS and HiPIMS sputtered CIGS films from a quaternary target
Using a quaternary compound target, Cu(In,Ga)Se2 films were prepared using one‐step, selenization‐free Direct Current Magneton Sputtering (DcMS) and High Power Impulse Magnetron Sputtering (HiPIMS) methods. We investigated how the sputtering power affected the composition, microstructure, morphology, and electrical characteristics of the films. Film crystallinity was found to be affected by the sputtering power utilized. The films deposited at 0.25 kW were amorphous, whereas those formed at 0.5–1 kW displayed a chalcopyrite structure with a (112)–preferred orientation. With increased sputtering power, the films’ crystal quality improved, displaying a homogeneous and compact morphology free of peeling and cracking. Elemental measurement of the CIGS films revealed that, depending on the deposition method, the film composition deviated from that of the target. The electrical properties of the deposited films varied with increasing sputtering power.This article is protected by copyright. All rights reserved.
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