通过吞噬芯片表面上的突起微钉来提高神经元与电子器件表面的粘附性

M. Spira, D. Kamber, A. Dormann, A. Cohen, C. Bartic, G. Borghs, J. Langedijk, S. Yitzchaik, K. Shabthai, J. Shappir
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引用次数: 40

摘要

装配高效的神经电子混合系统的主要问题之一是组件之间的低电耦合。这主要是由于低阻力,细胞的质膜和它所粘附的底物之间形成细胞外裂缝。这个间隙会分流由神经元或装置产生的电流,从而降低信噪比。为了增加缝隙电阻,我们制作了从晶体管栅极表面突出的金微钉。利用促吞噬肽对微钉螺进行功能化处理。培养的神经元很容易吞噬功能化的微指甲,在细胞和装置表面之间形成紧密的物理接触。
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Improved Neuronal Adhesion to the Surface of Electronic Device by Engulfment of Protruding Micro-Nails Fabricated on the Chip Surface
One of the major problems in assembling efficient neuro-electronic hybrids systems is the low electrical coupling between the components. This is mainly due to the low resistance, extracellular cleft formed between the cell's plasma membrane and the substrate to which it adhere. This cleft shunts the current generated by the neuron, or the device and thus reduces the signal to noise ratio. To increase the clefts electrical resistance we fabricated gold micronails that protrude from the transistor gate surface. The micronails were functionalized by phagocytosis facilitating peptides. Cultured neurons readily engulf the functionalized micronails forming tight physical contact between the cells and the surface of the device.
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