2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
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2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - 最新文献
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Pub Date : 2011-04-18
DOI: 10.1109/ESIME.2011.5765770
P. Gromala, J. Duerr, M. Dressler, K. Jansen, M. Hawryluk, J. de Vreugd
Pub Date : 2011-04-18
DOI: 10.1109/ESIME.2011.5765779
Y. Jinghua, Hua Qing, He Yanqiang, Cao Yi-jiang, Chen Minghua, Liu Ting, L. Xiaowei
Pub Date : 2011-04-18
DOI: 10.1109/ESIME.2011.5765848
W. V. van Driel, C. Yuan, S. Koh, G.Q. Zhang
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