ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

615

微信好友朋友圈 QQ好友复制链接

查看最新文献

发文信息

ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 最新文献

查看全部

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97587 Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik V. Bansode, Vibin Shalom Simon, D. Agonafer

Multiphysics Co-Optimization Design and Analysis of a Double-Side-Cooled Silicon Carbide-Based Power Module

Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-97355 Xuhui Feng, G. Moreno, S. Narumanchi, P. Paret

Naturally-Cooled Heat Sinks for Next-Generation Battery Chargers

Pub Date : 2022-10-25 DOI: 10.1115/ipack2022-98077 C. Chhokar, G. B. Abadi, Nicholas McDaniel, Chris Botting, M. Bahrami

免责声明：
本页显示期刊或杂志信息，仅供参考学习，不是任何期刊杂志官网，不涉及出版事务，特此申明。如需出版一切事务需要用户自己向出版商联系核实。若本页展示内容有任何问题，请联系我们，邮箱：info@booksci.cn，我们会认真核实处理。

Book学术文献互助群
群号：481959085

文献互助智能选刊最新文献互助须知联系我们：info@booksci.cn