2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Optimal heat transfer performance of the microfluidic electrospray cooling devices

Pub Date : 2011-03-20 DOI: 10.1109/STHERM.2011.5767175 H. Wang, A. Mamishev

Transient dual interface measurement — A new JEDEC standard for the measurement of the junction-to-case thermal resistance

Pub Date : 2011-03-20 DOI: 10.1109/STHERM.2011.5767204 D. Schweitzer, H. Pape, Liu Chen, R. Kutscherauer, Martin Walder

Thermal scaling consideration of Si MOSFETs with gate length typically larger than 100 nm

Pub Date : 2011-03-20 DOI: 10.1109/STHERM.2011.5767196 K. Fushinobu, T. Hatakeyama