2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs

Pub Date : 2020-12-14 DOI: 10.1109/EDAPS50281.2020.9312897 Keeyoung Son, Subin Kim, Shinyoung Park, Hyunwook Park, Keunwoo Kim, Taein Shin, Minsu Kim, Kyungjune Son, Gapyeol Park, Seungtaek Jeong, Joungho Kim

Sub-picosecond Skew Matching

Pub Date : 2020-12-14 DOI: 10.1109/EDAPS50281.2020.9312916 Minh Quach, N. Devnani, Mark Hinton, R. Kaw

Design and Measurement of a HDMI 2.1 Connector for 8K TV considering Signal Integrity

Pub Date : 2020-12-14 DOI: 10.1109/EDAPS50281.2020.9312909 Gapyeol Park, Hyunwook Park, Daehwan Lho, Junyong Park, Kyungjune Son, Seongguk Kim, Taein Shin, Keeyoung Son, Joonsang Park, Joungho Kim, Junho Lee, Seong-Joon Choi