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2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

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2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - 最新文献

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Study on the chip-level thermal non-uniformity evaluation of semiconductor devices

Pub Date : 2009-07-06 DOI: 10.1109/IPFA.2009.5232587 Zhang Guangchen, F. Shiwei, Zhang Yuezong, Su Rong, Xie Xuesong, Ge Chenning

Reliability evaluation of power VDMOSFET

Pub Date : 2009-07-06 DOI: 10.1109/IPFA.2009.5232635 Yun-Xia Bai, Chun-sheng Guo, S. Feng, Kaikai Ding, Si-Xiang Zhuang, Rong Su

Packaging and reliability research on automobiles micro-pressure sensor

Pub Date : 2009-07-06 DOI: 10.1109/IPFA.2009.5232646 R. Guan
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