2019 International Conference on Electronics Packaging (ICEP)

How TIM impacts thermal performance of electronics: : A thermal point of view study to understand impact of Thermal Interface Material (TIM)

Pub Date : 2019-04-17 DOI: 10.23919/ICEP.2019.8733441 Tejas Manohar Kesarkar, Nitesh Kumar Sardana

Air-stable Cu complex inks for printed electronics with high conductivity and high reliability

Pub Date : 2019-04-17 DOI: 10.23919/ICEP.2019.8733423 Wanli Li, Qingqing Sun, Xuying Liu, K. Suganuma, T. Minari

Room-temperature printing of CNTs-based flexible TFTs with high performance

Pub Date : 2019-04-17 DOI: 10.23919/ICEP.2019.8733561 Qingqing Sun, Wanli Li, Xuying Liu, M. Kanehara, Jianwen Zhao, T. Minari