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2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

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2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

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2014 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) - 最新文献

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Meter-scale pressure sensor array with woven conductive-polymer-coated fibers

Pub Date : 2014-04-01 DOI: 10.1109/DTIP.2014.7056669 S. Takamatsu, T. Yamashita, T. Itoh

Direct digital synthesiser (DDS) design parameters optimisation for vibrating MEMS sensors: Optimisation of phase accumulator, Look-Up Table (LUT) and Digital to Analog Converter (DAC) sizes

Pub Date : 2014-04-01 DOI: 10.1109/DTIP.2014.7056692 Marechal Baptiste, G. Jean, Levy Raphael, Le Traon Olivier, Mailly Frederick, Nouet Pascal

Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs

Pub Date : 2014-04-01 DOI: 10.1109/DTIP.2014.7056631 N. Lietaer, A. Summanwar, Sara Rund Herum, Leny Nazareno
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