2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - 最新文献

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Intuitive PI: Simulator-less Analysis Methodology

Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193231 B. Silva, Y. F. Shen

Measurement-assisted extraction of PCB interconnect model parameters with fabrication variations

Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193228 A. Manukovsky, Y. Shlepnev

Bayesian Optimization of High-Speed Channel for Signal Integrity Analysis

Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193211 Daehwan Lho, Junyong Park, Hyunwook Park, Shinyoung Park, Seongguk Kim, Hyungmin Kang, Subin Kim, Gapyeol Park, Kyungjune Son, Joungho Kim

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