2019 International 3D Systems Integration Conference (3DIC)

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Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers

Pub Date : 2019-10-01 DOI: 10.1109/3DIC48104.2019.9058778 K. Takemura, A. Ukita, Y. Ibusuki, M. Kurihara, A. Noriki, T. Amano, D. Okamoto, Yasuyuki Suzuki, K. Kurata

Variability Cancellation to Improve Diagnostic Performance of Testing through Silicon Vias in Power Distribution Network of 3D-IC

Pub Date : 2019-10-01 DOI: 10.1109/3DIC48104.2019.9058881 K. Hachiya, A. Kurokawa

Design Enablement of Fine Pitch Face-to-Face 3D System Integration using Die-by-Die Place & Route

Pub Date : 2019-10-01 DOI: 10.1109/3DIC48104.2019.9058901 G. Sisto, P. Debacker, Rongmei Chen, G. V. D. Plas, R. Chou, E. Beyne, D. Milojevic

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