2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)

Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications

Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117216 Sheng-Feng Hsiao, Ming-Kun Chen, Yi-Lung Lin, Yu-Jung Huang, S. Fu

Comparison among individual thermal cycling, vibration test and the combined test for the life estimation of electronic components

Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117152 Y. S. Chen, Yang-Sin Lee, Yu-Cheng Lin

Total system power minimization of microprocessors using refrigerated systems for electronic cooling

Pub Date : 2011-12-29 DOI: 10.1109/IMPACT.2011.6117155 Won Ho Park, Ron McCall, C. K. Yang