2019 42nd International Spring Seminar on Electronics Technology (ISSE)

Refined Approach on Controlling Heat Transfer in a Vapour Phase Soldering Oven

Pub Date : 2019-05-15 DOI: 10.1109/ISSE.2019.8810288 A. Géczy, Balázs Kiss, A. Alaya, Z. Illyefalvi-Vitéz

Sustainable and Secure Soldering of Complex Components with Package BGA, LGA, Flip Chip, FI WLCSP, FO WLCSP to Star Flex PCB Using Hybrid Printing

Pub Date : 2019-05-15 DOI: 10.1109/ISSE.2019.8810279 V. Tsenev

Development of a New Fabrication Method of Thermoelectric Microgenerators

Pub Date : 2019-05-15 DOI: 10.1109/ISSE.2019.8810251 M. Gierczak, P. Markowski, A. Dziedzic