Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810288
A. Géczy, Balázs Kiss, A. Alaya, Z. Illyefalvi-Vitéz
The control of soldering temperature profiles is crucial in any reflow process of electronic assemblies. In our paper a novel approach is presented on the control of the temperature during vapour phase soldering process. In the given case the electronic surface mounted assembly to be soldered is immersed into the vapour with a special sample holder system and moved up and down by a flexible LabVIEW hardware and software configuration. It was found that with proper data acquisition and appropriate programming, the system is able to follow pre-programmed soldering profiles with small deviation. The paper presents the system, the experimental configuration and initial results obtained with the setup. The proposed setup can improve the current view on proper heat transfer handling in VPS ovens, and also enables precise control on investigations with different low-temperature solder alloys, and most importantly, thermally sensitive substrates, such as biodegradable epoxies, or moulded interconnect devices.
{"title":"Refined Approach on Controlling Heat Transfer in a Vapour Phase Soldering Oven","authors":"A. Géczy, Balázs Kiss, A. Alaya, Z. Illyefalvi-Vitéz","doi":"10.1109/ISSE.2019.8810288","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810288","url":null,"abstract":"The control of soldering temperature profiles is crucial in any reflow process of electronic assemblies. In our paper a novel approach is presented on the control of the temperature during vapour phase soldering process. In the given case the electronic surface mounted assembly to be soldered is immersed into the vapour with a special sample holder system and moved up and down by a flexible LabVIEW hardware and software configuration. It was found that with proper data acquisition and appropriate programming, the system is able to follow pre-programmed soldering profiles with small deviation. The paper presents the system, the experimental configuration and initial results obtained with the setup. The proposed setup can improve the current view on proper heat transfer handling in VPS ovens, and also enables precise control on investigations with different low-temperature solder alloys, and most importantly, thermally sensitive substrates, such as biodegradable epoxies, or moulded interconnect devices.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"37 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76187813","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810279
V. Tsenev
The application of hybrid printing for the sustainable and secure soldering of complex components with package BGA, LGA, Flip Chip, FI WLCSP, FO WLCSP to the Star Flex PCB is presented. Several types of solder pastes can be applied by means of hybrid print in a single printing process, which in a single reflow process allows different soldering times for different components of the board on which various thermosensitive components may be placed. This allows to obtain low-void solder of thermosensitive or complex components. Experimental results are presented using different solder pastes and various complex components. The analysis was done using microscopy and Xray imaging/analysis.
{"title":"Sustainable and Secure Soldering of Complex Components with Package BGA, LGA, Flip Chip, FI WLCSP, FO WLCSP to Star Flex PCB Using Hybrid Printing","authors":"V. Tsenev","doi":"10.1109/ISSE.2019.8810279","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810279","url":null,"abstract":"The application of hybrid printing for the sustainable and secure soldering of complex components with package BGA, LGA, Flip Chip, FI WLCSP, FO WLCSP to the Star Flex PCB is presented. Several types of solder pastes can be applied by means of hybrid print in a single printing process, which in a single reflow process allows different soldering times for different components of the board on which various thermosensitive components may be placed. This allows to obtain low-void solder of thermosensitive or complex components. Experimental results are presented using different solder pastes and various complex components. The analysis was done using microscopy and Xray imaging/analysis.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"122 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87694515","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810251
M. Gierczak, P. Markowski, A. Dziedzic
Hybrid thermoelectric microgenerators, which are based on magnetron sputtered constantan (alloy of copper and nickel)and screen-printed silver, deposited on alumina substrate, were manufactured and characterized in previous research [1]. This paper describes new fabrication method of mixed microgenerators on LTCC substrates. Thermopiles consist of sixteen thermocouples, in which one arms were made from magnetron sputtered constantan and the remaining arms - as screen-printed Ag-based film. Single thermocouple arm was 27 mm long, and 0.3 mm wide. The distance between arms was equal to 0.3 mm. Microgenerators were performed on 34×28×O.2 mm3 substrates. Firstly, the substrates were prepared, then the constantan layer was deposited by magnetron sputtering on the whole substrates in a vacuum. Next, the photolithography was carried out using the previously prepared photomask. The etching process in the appropriate solution exposed the first thermocouples arms. The low-temperature silver ink was screen-printed onto the LTCC substrate and then fired in a nitrogen atmosphere in order to create the second arms of the thermopile. Thermoelectric and electric parameters of such structures were characterized in detail.
{"title":"Development of a New Fabrication Method of Thermoelectric Microgenerators","authors":"M. Gierczak, P. Markowski, A. Dziedzic","doi":"10.1109/ISSE.2019.8810251","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810251","url":null,"abstract":"Hybrid thermoelectric microgenerators, which are based on magnetron sputtered constantan (alloy of copper and nickel)and screen-printed silver, deposited on alumina substrate, were manufactured and characterized in previous research [1]. This paper describes new fabrication method of mixed microgenerators on LTCC substrates. Thermopiles consist of sixteen thermocouples, in which one arms were made from magnetron sputtered constantan and the remaining arms - as screen-printed Ag-based film. Single thermocouple arm was 27 mm long, and 0.3 mm wide. The distance between arms was equal to 0.3 mm. Microgenerators were performed on 34×28×O.2 mm3 substrates. Firstly, the substrates were prepared, then the constantan layer was deposited by magnetron sputtering on the whole substrates in a vacuum. Next, the photolithography was carried out using the previously prepared photomask. The etching process in the appropriate solution exposed the first thermocouples arms. The low-temperature silver ink was screen-printed onto the LTCC substrate and then fired in a nitrogen atmosphere in order to create the second arms of the thermopile. Thermoelectric and electric parameters of such structures were characterized in detail.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"77 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88109485","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810293
J. Prásek, D. Houška, R. Hrdy, J. Hubálek, U. Schmid
In this paper we optimize cryogenic deep reactive ion etching processes to achieve the best aspect ratios of holes in a silicon substrate that is supposed to be used for fabrication of on-chip energy storage. By optimizing capacitively coupled plasma source power and oxygen flow, aspect ratio of 28:1 for holes of 2 μm in diameter was achieved. Bottling effect was suppressed by tuning capacitively coupled plasma, inductively coupled plasma sources and process pressure at the same time. The smoothness and purity of the hole walls are other parameters we investigate using atomic force microscopy and X-ray photoelectron spectroscopy.
{"title":"Optimization of Cryogenic Deep Reactive Ion Etching Process for On-Chip Energy Storage","authors":"J. Prásek, D. Houška, R. Hrdy, J. Hubálek, U. Schmid","doi":"10.1109/ISSE.2019.8810293","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810293","url":null,"abstract":"In this paper we optimize cryogenic deep reactive ion etching processes to achieve the best aspect ratios of holes in a silicon substrate that is supposed to be used for fabrication of on-chip energy storage. By optimizing capacitively coupled plasma source power and oxygen flow, aspect ratio of 28:1 for holes of 2 μm in diameter was achieved. Bottling effect was suppressed by tuning capacitively coupled plasma, inductively coupled plasma sources and process pressure at the same time. The smoothness and purity of the hole walls are other parameters we investigate using atomic force microscopy and X-ray photoelectron spectroscopy.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"29 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73981768","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810299
D. Bušek, K. Dušek, T. Beran, P. Veselý
The article deals with the heating factor influence on the solder joint reliability. A specific goal was to reveal the influence of the heating factor on the thickness of the Intermetallic Layer (IML)for Copper, Electroless Nickel Immersion Gold (ENIG)and Hot Air Solder Levelling (HASL)surface finishes and two lead free solders Sn42Bi58 and Sn99.3CuO. 7. Three different heating factors were used for hot air reflow of the Bismuth solder paste and another three for reflow of the SnCu solder paste. Micro-sections were prepared and the IMC (Inter-Metallic Compound)layer thickness was measured. The manufactured samples were subjected to destructive shear strength testing at laboratory temperature (20 °C)and at 65 °C. The results show an influence of intermetallic layer thickness on the shear strength and a minor decrease of the shear strength at elevated testing temperature for a low temperature Bismut based solder paste. When SnCu solder was used, the IMC layer was thicker and also the shear strength was lower, in an average (on all surface finishes)by 19%.
{"title":"Thermo-Mechanical Test of SnBi and SnCu Solder Joints on Different Surface Finishes","authors":"D. Bušek, K. Dušek, T. Beran, P. Veselý","doi":"10.1109/ISSE.2019.8810299","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810299","url":null,"abstract":"The article deals with the heating factor influence on the solder joint reliability. A specific goal was to reveal the influence of the heating factor on the thickness of the Intermetallic Layer (IML)for Copper, Electroless Nickel Immersion Gold (ENIG)and Hot Air Solder Levelling (HASL)surface finishes and two lead free solders Sn42Bi58 and Sn99.3CuO. 7. Three different heating factors were used for hot air reflow of the Bismuth solder paste and another three for reflow of the SnCu solder paste. Micro-sections were prepared and the IMC (Inter-Metallic Compound)layer thickness was measured. The manufactured samples were subjected to destructive shear strength testing at laboratory temperature (20 °C)and at 65 °C. The results show an influence of intermetallic layer thickness on the shear strength and a minor decrease of the shear strength at elevated testing temperature for a low temperature Bismut based solder paste. When SnCu solder was used, the IMC layer was thicker and also the shear strength was lower, in an average (on all surface finishes)by 19%.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"31 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87398811","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810296
I. Zhivkov, R. Yordanov, G. Dobrikov, I. Yordanova, M. Weiter
Setup for impedance measurement based on AD5933 impedance convertor was accomplished and tested with a measurement of control samples. Introducing an external clock generator allows to extend the excitation frequencies in the range of 1 00 Hz÷50 KHz. An external analog front end schematics was added to reduce the output impedance and facilitate the measurement. The external analog front end includes low pass filter, voltage follower and current to voltage convertor. The measurement performed is in a good agreement with data taken from control impedance analyzer. The noise and signal distortion is considerable reduced using galvanic insulation between the personal computer and microcontroller from one side and the AD5933 impedance converter and the analog front end from the other. The relative error with respect to reference calibration resistors is within the range of $pm 0.5$ %. A stability test shows that the change of the impedance with the time is less than 10 %, measured over 60 hours. A measurement of ionic liquid used as a simplified biomedical impedance model is with a good compliance with data, taken from a precise impedance analyzer.
{"title":"Computer Controlled System for Impedance Measurements","authors":"I. Zhivkov, R. Yordanov, G. Dobrikov, I. Yordanova, M. Weiter","doi":"10.1109/ISSE.2019.8810296","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810296","url":null,"abstract":"Setup for impedance measurement based on AD5933 impedance convertor was accomplished and tested with a measurement of control samples. Introducing an external clock generator allows to extend the excitation frequencies in the range of 1 00 Hz÷50 KHz. An external analog front end schematics was added to reduce the output impedance and facilitate the measurement. The external analog front end includes low pass filter, voltage follower and current to voltage convertor. The measurement performed is in a good agreement with data taken from control impedance analyzer. The noise and signal distortion is considerable reduced using galvanic insulation between the personal computer and microcontroller from one side and the AD5933 impedance converter and the analog front end from the other. The relative error with respect to reference calibration resistors is within the range of $pm 0.5$ %. A stability test shows that the change of the impedance with the time is less than 10 %, measured over 60 hours. A measurement of ionic liquid used as a simplified biomedical impedance model is with a good compliance with data, taken from a precise impedance analyzer.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"13 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88830066","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810291
M. V. Nikolić, M. Lukovic, M. Dojcinovic, Z. Vasiljevic, N. Labus
Iron manganite (FeMnO3) thick film samples were obtained by screen printing four layers of thick film paste on alumina substrate with test PdAg electrodes. The paste was made by adding organic vehicles to iron manganite powder obtained by solid state synthesis of starting hematite $(alpha-F{e}_{2}O_{3})$ and manganese carbonate (MnCO3)powders. SEM analysis of the sample surface revealed a porous structure with a uniform particle size distribution. The average resulting film thickness was 48 μ m. The change of impedance was monitored in a humidity chamber in the relative humidity range 30-90% at three working temperatures: 25, 50 and $75^{circ}C$ in the frequency range 42 Hz to 1 MHz. With increase in relative humidity the measured impedance decreased, showing the greatest difference at lower frequency with a low time delay (below 3%)between absorption and desorption processes (hysteresis). The sensor response and recovery times were several seconds.
{"title":"Application of Iron Manganite Thick Films for Humidity Sensing","authors":"M. V. Nikolić, M. Lukovic, M. Dojcinovic, Z. Vasiljevic, N. Labus","doi":"10.1109/ISSE.2019.8810291","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810291","url":null,"abstract":"Iron manganite (FeMnO3) thick film samples were obtained by screen printing four layers of thick film paste on alumina substrate with test PdAg electrodes. The paste was made by adding organic vehicles to iron manganite powder obtained by solid state synthesis of starting hematite $(alpha-F{e}_{2}O_{3})$ and manganese carbonate (MnCO3)powders. SEM analysis of the sample surface revealed a porous structure with a uniform particle size distribution. The average resulting film thickness was 48 μ m. The change of impedance was monitored in a humidity chamber in the relative humidity range 30-90% at three working temperatures: 25, 50 and $75^{circ}C$ in the frequency range 42 Hz to 1 MHz. With increase in relative humidity the measured impedance decreased, showing the greatest difference at lower frequency with a low time delay (below 3%)between absorption and desorption processes (hysteresis). The sensor response and recovery times were several seconds.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"14 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88498187","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810266
Peter Čech, A. Pietrikova
This paper present designs of inset feeding rectangular microstrip antennas on different substrates with different dielectric constants (FR4 laminate, Green Tape™ 951 LTCC from DuPont and RT/duroid 6010LM from Rogers Corporation). All of antennas were designed for 2.45 GHz frequency band that is one of the most common frequency band for modern wireless communication (WiFi or Bluetooth). Antennas were simulated and results were realized from antenna miniaturization point of view. For antenna miniaturization were used substrates with higher dielectric constant ($varepsilon_{r}$) at approximately similar substrate thickness. CST Microwave Studio was used for design and optimization of antennas. As a result of our simulations, we find that with an increase of $varepsilon_{r}$ the antenna area will be reduced but at the detriment of the reduction of the bandwidth at −10 dB. It is possible to eliminate this problem with the increase of the thickness of the substrate. In this way it is possible to achieve required miniaturization while maintaining the possibility of using this antenna in the WiFi area.
{"title":"Design of Microstrip Antennas for 2.45 GHz on Different Substrates","authors":"Peter Čech, A. Pietrikova","doi":"10.1109/ISSE.2019.8810266","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810266","url":null,"abstract":"This paper present designs of inset feeding rectangular microstrip antennas on different substrates with different dielectric constants (FR4 laminate, Green Tape™ 951 LTCC from DuPont and RT/duroid 6010LM from Rogers Corporation). All of antennas were designed for 2.45 GHz frequency band that is one of the most common frequency band for modern wireless communication (WiFi or Bluetooth). Antennas were simulated and results were realized from antenna miniaturization point of view. For antenna miniaturization were used substrates with higher dielectric constant ($varepsilon_{r}$) at approximately similar substrate thickness. CST Microwave Studio was used for design and optimization of antennas. As a result of our simulations, we find that with an increase of $varepsilon_{r}$ the antenna area will be reduced but at the detriment of the reduction of the bandwidth at −10 dB. It is possible to eliminate this problem with the increase of the thickness of the substrate. In this way it is possible to achieve required miniaturization while maintaining the possibility of using this antenna in the WiFi area.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"62 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83938435","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810176
Reinhardt Seidel, A. Mayr, Franziska Schäfer, Dominik Kißkalt, J. Franke
High quality and low costs are main drivers in electronics production. Regardless of the application, the trend towards batch size 1 heavily challenges current production systems. With higher data availability, the application of machine learning (ML) has great potential for the future of electronics production. Therefore, this paper gives an overview about exemplary investigations of ML techniques in the assembly of surface mount devices (SMD) and shows the need for a systematic proceeding when searching for profitable ML use cases. In doing so, a process-oriented methodology for the identification of ML use cases is derived, paving the way towards a smart electronics production.
{"title":"Towards a Smart Electronics Production Using Machine Learning Techniques","authors":"Reinhardt Seidel, A. Mayr, Franziska Schäfer, Dominik Kißkalt, J. Franke","doi":"10.1109/ISSE.2019.8810176","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810176","url":null,"abstract":"High quality and low costs are main drivers in electronics production. Regardless of the application, the trend towards batch size 1 heavily challenges current production systems. With higher data availability, the application of machine learning (ML) has great potential for the future of electronics production. Therefore, this paper gives an overview about exemplary investigations of ML techniques in the assembly of surface mount devices (SMD) and shows the need for a systematic proceeding when searching for profitable ML use cases. In doing so, a process-oriented methodology for the identification of ML use cases is derived, paving the way towards a smart electronics production.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"70 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84090366","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-05-15DOI: 10.1109/ISSE.2019.8810246
A. Otáhal, J. Skácel, I. Szendiuch
The main aim of this work was to show a new approach in using brazing technology (hard soldering) on thick film conductors. Metallic leads and thick film conductors on alumina substrate were used to verify brazed joints. A flame and conductive heat transfer methods were used for brazing of three braze alloys such as Ag15CuP, Ag40Sn and Ag45CuZn. The tested pattern was made using silver (Ag) and silver-palladium (AgPd) thick film pastes on 96% Al2O3 substrate by screen printed technique and followed by firing process at temperature 850 °C. Nickel-silver and nickel-chromium-titanium leads were brazed on the thick film conductors with subsequent evaluation of the shear and the pull strength joints. The results of this work demonstrated very effective brazing technology on thick film conductors without usage of protective atmosphere or oven.
{"title":"New Possible Way for Brazing of Thick Film Cermet Conductors","authors":"A. Otáhal, J. Skácel, I. Szendiuch","doi":"10.1109/ISSE.2019.8810246","DOIUrl":"https://doi.org/10.1109/ISSE.2019.8810246","url":null,"abstract":"The main aim of this work was to show a new approach in using brazing technology (hard soldering) on thick film conductors. Metallic leads and thick film conductors on alumina substrate were used to verify brazed joints. A flame and conductive heat transfer methods were used for brazing of three braze alloys such as Ag15CuP, Ag40Sn and Ag45CuZn. The tested pattern was made using silver (Ag) and silver-palladium (AgPd) thick film pastes on 96% Al2O3 substrate by screen printed technique and followed by firing process at temperature 850 °C. Nickel-silver and nickel-chromium-titanium leads were brazed on the thick film conductors with subsequent evaluation of the shear and the pull strength joints. The results of this work demonstrated very effective brazing technology on thick film conductors without usage of protective atmosphere or oven.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"30 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2019-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81637161","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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