2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

Investigation on the Mechanical Behavior Evolution Occurring in Lead Free Solder Joints Exposed to Thermal Cycling

Pub Date : 2020-06-01 DOI: 10.1109/ectc32862.2020.00235 Abdullah Fahim, S. K. Kamrul Hasan, J. Suhling, P. Lall

Polyimide Fine-via Etching and Low-damage Surface-modification Process For High-density Fan-out Wafer Level Package

Pub Date : 2020-06-01 DOI: 10.1109/ectc32862.2020.00147 Y. Morikawa, Daisuke Hironiwa, T. Murayama

Development of Embedded Glass Wafer Fan-Out Package With 2D Antenna Arrays for 77GHz Millimeter-wave Chip

Pub Date : 2020-06-01 DOI: 10.1109/ectc32862.2020.00018 Tian Yu, Xiaodong Zhang, Li Chen, Xiaoli Ren, Zongming Duan, Daquan Yu