2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

Further Enhancement of Thermal Conductivity through Optimal Uses of h-BN Fillers in Polymer-Based Thermal Interface Material for Power Electronics

Pub Date : 2019-08-26 DOI: 10.1109/ECTC.2019.00241 Hanqing Jiang, Han Zhou, S. Robertson, Zhaoxia Zhou, Liguo Zhao, Changqing Liu

A Novel Design of a Bandwidth Enhanced Dual-Band Impedance Matching Network with Coupled Line Wave Slowing

Pub Date : 2019-05-30 DOI: 10.1109/ECTC.2019.00271 D. Banerjee, A. Saxena, M. Hashmi

Die-to-Wafer (D2W) Processing and Reliability for 3D Packaging of Advanced Node Logic

Pub Date : 2019-05-28 DOI: 10.1109/ECTC.2019.00096 L. England, D. Fisher, K. Rivera, B. Guthrie, Ping-Jui Kuo, Chang-Chi Lee, Che-Ming Hsu, Fan-Yu Min, Kuo-Chang Kang, Chen-Yuan Weng