A soft, high-density neuroelectronic array

IF 12.3 1区 材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC npj Flexible Electronics Pub Date : 2023-08-22 DOI:10.1038/s41528-023-00271-2
Kyung Jin Seo, Mackenna Hill, Jaehyeon Ryu, Chia-Han Chiang, Iakov Rachinskiy, Yi Qiang, Dongyeol Jang, Michael Trumpis, Charles Wang, Jonathan Viventi, Hui Fang
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Abstract

Techniques to study brain activities have evolved dramatically, yet tremendous challenges remain in acquiring high-throughput electrophysiological recordings minimally invasively. Here, we develop an integrated neuroelectronic array that is filamentary, high-density and flexible. Specifically, with a design of single-transistor multiplexing and current sensing, the total 256 neuroelectrodes achieve only a 2.3 × 0.3 mm2 area, unprecedentedly on a flexible substrate. A single-transistor multiplexing acquisition circuit further reduces noise from the electrodes, decreases the footprint of each pixel, and potentially increases the device’s lifetime. The filamentary neuroelectronic array also integrates with a rollable contact pad design, allowing the device to be injected through a syringe, enabling potential minimally invasive array delivery. Successful acute auditory experiments in rats validate the ability of the array to record neural signals with high tone decoding accuracy. Together, these results establish soft, high-density neuroelectronic arrays as promising devices for neuroscience research and clinical applications.

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软性高密度神经电子阵列
研究大脑活动的技术已经有了长足的发展,但在以微创方式获取高通量电生理记录方面仍面临巨大挑战。在这里,我们开发了一种丝状、高密度和灵活的集成神经电子阵列。具体来说,通过单晶体管复用和电流感应设计,总共 256 个神经电极的面积仅为 2.3 × 0.3 平方毫米,这在柔性基底上是前所未有的。单晶体管多路复用采集电路进一步降低了来自电极的噪声,减少了每个像素的占地面积,并有可能延长设备的使用寿命。丝状神经电子阵列还集成了可滚动接触垫设计,允许通过注射器注射该装置,从而实现潜在的微创阵列传输。在大鼠身上成功进行的急性听觉实验验证了该阵列记录神经信号的能力,具有很高的音调解码精度。这些研究成果共同确立了软性高密度神经电子阵列作为神经科学研究和临床应用设备的前景。
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来源期刊
CiteScore
17.10
自引率
4.80%
发文量
91
审稿时长
6 weeks
期刊介绍: npj Flexible Electronics is an online-only and open access journal, which publishes high-quality papers related to flexible electronic systems, including plastic electronics and emerging materials, new device design and fabrication technologies, and applications.
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