Co-packaged optics (CPO): status, challenges, and solutions.

IF 4.1 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Frontiers of Optoelectronics Pub Date : 2023-03-20 DOI:10.1007/s12200-022-00055-y
Min Tan, Jiang Xu, Siyang Liu, Junbo Feng, Hua Zhang, Chaonan Yao, Shixi Chen, Hangyu Guo, Gengshi Han, Zhanhao Wen, Bao Chen, Yu He, Xuqiang Zheng, Da Ming, Yaowen Tu, Qiang Fu, Nan Qi, Dan Li, Li Geng, Song Wen, Fenghe Yang, Huimin He, Fengman Liu, Haiyun Xue, Yuhang Wang, Ciyuan Qiu, Guangcan Mi, Yanbo Li, Tianhai Chang, Mingche Lai, Luo Zhang, Qinfen Hao, Mengyuan Qin
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引用次数: 1

Abstract

Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology.

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共封装光学(CPO):现状、挑战和解决方案。
由于5G、物联网、人工智能和高性能计算应用的兴起,数据中心流量以近30%的年复合增长率增长。此外,近四分之三的数据中心流量驻留在数据中心内。传统的可插拔光学器件的增长速度远低于数据中心流量的增长速度。传统可插拔光学器件的应用需求与性能之间的差距越来越大,这种趋势是不可持续的。共封装光学(CPO)是一种颠覆性的方法,通过先进的封装和电子和光子学的协同优化,大大缩短电链路长度,从而提高互连带宽密度和能量效率。CPO被广泛认为是未来数据中心互连的一种很有前途的解决方案,而硅平台是大规模集成最有前途的平台。领先的国际公司(如英特尔、博通和IBM)已经对CPO技术进行了大量研究,这是一个跨学科的研究领域,涉及光子器件、集成电路设计、封装、光子器件建模、电子-光子联合仿真、应用和标准化。本文旨在为读者提供硅平台上CPO的最新进展的全面概述,识别关键挑战,并指出潜在的解决方案,希望鼓励不同研究领域之间的合作,以加速CPO技术的发展。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Frontiers of Optoelectronics
Frontiers of Optoelectronics ENGINEERING, ELECTRICAL & ELECTRONIC-
CiteScore
7.80
自引率
0.00%
发文量
583
期刊介绍: Frontiers of Optoelectronics seeks to provide a multidisciplinary forum for a broad mix of peer-reviewed academic papers in order to promote rapid communication and exchange between researchers in China and abroad. It introduces and reflects significant achievements being made in the field of photonics or optoelectronics. The topics include, but are not limited to, semiconductor optoelectronics, nano-photonics, information photonics, energy photonics, ultrafast photonics, biomedical photonics, nonlinear photonics, fiber optics, laser and terahertz technology and intelligent photonics. The journal publishes reviews, research articles, letters, comments, special issues and so on. Frontiers of Optoelectronics especially encourages papers from new emerging and multidisciplinary areas, papers reflecting the international trends of research and development, and on special topics reporting progress made in the field of optoelectronics. All published papers will reflect the original thoughts of researchers and practitioners on basic theories, design and new technology in optoelectronics. Frontiers of Optoelectronics is strictly peer-reviewed and only accepts original submissions in English. It is a fully OA journal and the APCs are covered by Higher Education Press and Huazhong University of Science and Technology. ● Presents the latest developments in optoelectronics and optics ● Emphasizes the latest developments of new optoelectronic materials, devices, systems and applications ● Covers industrial photonics, information photonics, biomedical photonics, energy photonics, laser and terahertz technology, and more
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