{"title":"A highly integrated 0.25 /spl mu/m BiCMOS chipset for 3G UMTS/WCDMA handset RF sub-system","authors":"D. Brunel, C. Caron, C. Cordier, E. Soudée","doi":"10.1109/RFIC.2002.1012029","DOIUrl":null,"url":null,"abstract":"The complete active portion of the 3G UMTS/WCDMA cellular handset RF sub-system is achieved with three RFICs. This chipset comprises a fully integrated ZIF receiver including RF VCO/PLL and UNITS clock generation, a fully Integrated direct conversion like transmitter including RF VCO/PLL, and a 25 dBm average power amplifier including power detection circuitry. The three RFICs use the same baseline 0.25 /spl mu/m BiCMOS technology opening possibilities to even higher integration level. This chipset is targeted at handset class 3 and 4 (PA is class 4 compatible only) European and Japanese 3 G UMTS and WCDMA standards.","PeriodicalId":299621,"journal":{"name":"2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers (Cat. No.02CH37280)","volume":"26 3","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"25","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers (Cat. No.02CH37280)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIC.2002.1012029","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 25
Abstract
The complete active portion of the 3G UMTS/WCDMA cellular handset RF sub-system is achieved with three RFICs. This chipset comprises a fully integrated ZIF receiver including RF VCO/PLL and UNITS clock generation, a fully Integrated direct conversion like transmitter including RF VCO/PLL, and a 25 dBm average power amplifier including power detection circuitry. The three RFICs use the same baseline 0.25 /spl mu/m BiCMOS technology opening possibilities to even higher integration level. This chipset is targeted at handset class 3 and 4 (PA is class 4 compatible only) European and Japanese 3 G UMTS and WCDMA standards.
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