K. Iwanabe, Kenichi Nakadozono, Y. Senda, T. Asano
{"title":"Room-temperature ultrasonic-bonding characteristics of compliant micro-bump investigated by ex-situ and in-situ measurements","authors":"K. Iwanabe, Kenichi Nakadozono, Y. Senda, T. Asano","doi":"10.1109/EPTC.2015.7412363","DOIUrl":null,"url":null,"abstract":"Room temperature microjoining of Au-Au or Cu-Cu bumps in the air ambient has been achieved by using the cone-shaped bumps with ultrasonic assist. This paper reports bonding mechanism investigated from the results of ex-situ and in-situ measurements. As an ex-situ measurement, we firstly investigate effect of the application of ultrasonic vibration on magnitude of plastic deformation of the compliant bump. We show that \"softening\" of the bumps take place under the application of ultrasonic vibration. Second, change in crystal texture near the bonded interface was analyzed to clarify how the ultrasonic bonding produce bonded interface at room-temperature. As an in-situ measurement, dynamic strain generated under the bonding pad is measured by using a strain gauge made of Si.","PeriodicalId":418705,"journal":{"name":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","volume":"19 12","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2015.7412363","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Room temperature microjoining of Au-Au or Cu-Cu bumps in the air ambient has been achieved by using the cone-shaped bumps with ultrasonic assist. This paper reports bonding mechanism investigated from the results of ex-situ and in-situ measurements. As an ex-situ measurement, we firstly investigate effect of the application of ultrasonic vibration on magnitude of plastic deformation of the compliant bump. We show that "softening" of the bumps take place under the application of ultrasonic vibration. Second, change in crystal texture near the bonded interface was analyzed to clarify how the ultrasonic bonding produce bonded interface at room-temperature. As an in-situ measurement, dynamic strain generated under the bonding pad is measured by using a strain gauge made of Si.
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