Signal integrity aware TSV positioning

L. Hou, Shu Bai, Jinhui Wang, Xiaohong Peng, Shuqin Geng
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引用次数: 1

Abstract

In this paper, a signal integrity aware TSV positioning method (SITP) is introduced. Grounded TSV proved to help eliminating TSV-to-TSV coupling. A trench based 3D IC placement method is developed, transforming 2D placement into 3D placement and perform signal TSV placement with flexible grounded TSV Insertion. IBM placement benchmark is used for original 2D placement. By evaluating wire-length and runtime, SITP automatically achieve high performance 3D IC placement with considerable TSV-TSV interference elimination.
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信号完整性感知TSV定位
本文介绍了一种感知信号完整性的TSV定位方法。接地TSV被证明有助于消除TSV到TSV的耦合。提出了一种基于沟槽的三维集成电路封装方法,将二维封装转化为三维封装,通过柔性接地的TSV插入实现信号TSV封装。IBM放置基准用于原始2D放置。通过评估导线长度和运行时间,SITP自动实现高性能3D IC放置,并消除TSV-TSV干扰。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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