{"title":"Finite Element Simulation of Electromigration near Crack Tip under Electric Load","authors":"T. Liu","doi":"10.1109/CPEEE56777.2023.10217564","DOIUrl":null,"url":null,"abstract":"This paper deals with the electromigration and associated physics under the electro-thermo-structural-diffusion coupled-field analysis. Using the finite element method, the atomic migration and distribution under the electric load are investigated. As a result, the locations of voids and hillocks can be determined.","PeriodicalId":364883,"journal":{"name":"2023 13th International Conference on Power, Energy and Electrical Engineering (CPEEE)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-02-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 13th International Conference on Power, Energy and Electrical Engineering (CPEEE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CPEEE56777.2023.10217564","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This paper deals with the electromigration and associated physics under the electro-thermo-structural-diffusion coupled-field analysis. Using the finite element method, the atomic migration and distribution under the electric load are investigated. As a result, the locations of voids and hillocks can be determined.
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