Complementary LDMOS transistors for a CMOS/BiCMOS process

S. Whiston, D. Bain, A. Deignan, J. Pollard, C. N. Chléirigh, C.M.M. O'Neill
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引用次数: 16

Abstract

This paper describes a methodology of using multiple implants that are self-aligned to the poly gate edge to form an LDMOS. This allows the implementation of complementary LDMOS devices onto existing CMOS/BiCMOS processes without the addition of any thermal treatments thereby having no effect on the existing CMOS/BiCMOS device performance. This approach gives greater flexibility in controlling the body doping profile in the lateral and vertical directions enabling threshold voltage (Vt) and breakdown voltage (BV) optimization for a wide range of source junctions that exist in many intrinsic and foundry processes.
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用于CMOS/BiCMOS工艺的互补LDMOS晶体管
本文描述了一种使用多个自对准多栅极边缘的植入物来形成LDMOS的方法。这允许在现有CMOS/BiCMOS工艺上实现互补的LDMOS器件,而无需添加任何热处理,因此不会影响现有CMOS/BiCMOS器件的性能。这种方法在控制横向和垂直方向的主体掺杂分布方面具有更大的灵活性,能够优化存在于许多内在和铸造工艺中的各种源结的阈值电压(Vt)和击穿电压(BV)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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Complementary LDMOS transistors for a CMOS/BiCMOS process Using "Adaptive resurf" to improve the SOA of LDMOS transistors Evaluation of 600 V/100 A NPT-IGBT with a non-self-align shallow p-well formation techniques A novel free wheeling diode for 1700 V IGBT module Low voltage CMOS compatible power MOSFET for on-chip DC/DC converters
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