S. Whiston, D. Bain, A. Deignan, J. Pollard, C. N. Chléirigh, C.M.M. O'Neill
{"title":"Complementary LDMOS transistors for a CMOS/BiCMOS process","authors":"S. Whiston, D. Bain, A. Deignan, J. Pollard, C. N. Chléirigh, C.M.M. O'Neill","doi":"10.1109/ISPSD.2000.856771","DOIUrl":null,"url":null,"abstract":"This paper describes a methodology of using multiple implants that are self-aligned to the poly gate edge to form an LDMOS. This allows the implementation of complementary LDMOS devices onto existing CMOS/BiCMOS processes without the addition of any thermal treatments thereby having no effect on the existing CMOS/BiCMOS device performance. This approach gives greater flexibility in controlling the body doping profile in the lateral and vertical directions enabling threshold voltage (Vt) and breakdown voltage (BV) optimization for a wide range of source junctions that exist in many intrinsic and foundry processes.","PeriodicalId":260241,"journal":{"name":"12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094)","volume":"25 5","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-05-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.2000.856771","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 16
Abstract
This paper describes a methodology of using multiple implants that are self-aligned to the poly gate edge to form an LDMOS. This allows the implementation of complementary LDMOS devices onto existing CMOS/BiCMOS processes without the addition of any thermal treatments thereby having no effect on the existing CMOS/BiCMOS device performance. This approach gives greater flexibility in controlling the body doping profile in the lateral and vertical directions enabling threshold voltage (Vt) and breakdown voltage (BV) optimization for a wide range of source junctions that exist in many intrinsic and foundry processes.