R. Waxman, M. T. McMahon, B. Crawford, A. DeAndrade
{"title":"Automated logic design techniques applicable to integrated circuitry technology","authors":"R. Waxman, M. T. McMahon, B. Crawford, A. DeAndrade","doi":"10.1145/1464291.1464319","DOIUrl":null,"url":null,"abstract":"Rapidly advancing integrated circuit technology has placed many new and often unforeseen demands on logic packaging techniques and, hence, is also impacting traditional computer design concepts. For instance, one of the most pertinent and immediate requirements is the optimum utilization of input/output (I/O) connections since the package size is strongly dependent on such connections. The package efficiency is measured in part by the I/O pin-to-circuit ratio, assuming the circuits in a package are connected in a way to provide an optimum logic function. Another potential problem to be considered is power dissipation, since integrated circuits may be contained in extremely small areas.","PeriodicalId":297471,"journal":{"name":"AFIPS '66 (Fall)","volume":"85 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1966-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"AFIPS '66 (Fall)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/1464291.1464319","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
Rapidly advancing integrated circuit technology has placed many new and often unforeseen demands on logic packaging techniques and, hence, is also impacting traditional computer design concepts. For instance, one of the most pertinent and immediate requirements is the optimum utilization of input/output (I/O) connections since the package size is strongly dependent on such connections. The package efficiency is measured in part by the I/O pin-to-circuit ratio, assuming the circuits in a package are connected in a way to provide an optimum logic function. Another potential problem to be considered is power dissipation, since integrated circuits may be contained in extremely small areas.