{"title":"Flexible epoxy for low stress electronic component encapsulation","authors":"M.T. Phenis","doi":"10.1109/EEIC.1999.826253","DOIUrl":null,"url":null,"abstract":"The following report compares the physical and mechanical properties of the new Thermoset ES-100 flexible epoxy material with two of the top flexible epoxy materials currently available on the market today. One of these materials is from a domestic US manufacturer and the other is from an overseas manufacturer. This report focuses on the thermal aging characteristics of these epoxy materials along with their chemical resistance and resistance to moisture.","PeriodicalId":415071,"journal":{"name":"Proceedings: Electrical Insulation Conference and Electrical Manufacturing and Coil Winding Conference (Cat. No.99CH37035)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-10-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings: Electrical Insulation Conference and Electrical Manufacturing and Coil Winding Conference (Cat. No.99CH37035)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EEIC.1999.826253","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The following report compares the physical and mechanical properties of the new Thermoset ES-100 flexible epoxy material with two of the top flexible epoxy materials currently available on the market today. One of these materials is from a domestic US manufacturer and the other is from an overseas manufacturer. This report focuses on the thermal aging characteristics of these epoxy materials along with their chemical resistance and resistance to moisture.
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