Ghil-geun Oh, Si-Jeong Kim, Kyeong-Ju Jin, Shin- Young Jung, Brandon Lee
{"title":"Impact of Wire RC Based on High Voltage SCAN Failure Analysis in 10nm Process","authors":"Ghil-geun Oh, Si-Jeong Kim, Kyeong-Ju Jin, Shin- Young Jung, Brandon Lee","doi":"10.1109/IPFA.2018.8452614","DOIUrl":null,"url":null,"abstract":"SCAN failure analysis that occurred only in the high voltage region was analyzed through in-circuit probing using laser voltage probing (LVP) technique in 10nm process. LVP results provided that high wire resistance of 4th metal layer had lead hold violation between launch and capture clock paths. This implies the importance of Back-End-Of-Line (BEOL) information that is monitored in mass production and design phase in high scaled process.","PeriodicalId":382811,"journal":{"name":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2018.8452614","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
SCAN failure analysis that occurred only in the high voltage region was analyzed through in-circuit probing using laser voltage probing (LVP) technique in 10nm process. LVP results provided that high wire resistance of 4th metal layer had lead hold violation between launch and capture clock paths. This implies the importance of Back-End-Of-Line (BEOL) information that is monitored in mass production and design phase in high scaled process.
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