Research on reliability Optimization design of multilayer porcelain dielectric capacitance of aerospace electronic products based on dynamic simulation

Abstract

In this paper, the cracking fault occurred in the dynamic environment of the multi-layer porcelain dielectric capacity used in a aerospace electronic product. The stress and deformation response in the PCB area where the multi-layer porcelain dielectric capacity is located are reduced by a reasonable PCB layout. Damping materials are added to PCB to reduce vibration. The nonlinear damping characteristics of material damping and energy filtering are used to realize energy consumption in the area of multi-layer porcelain dielectric capacity on PCB.