High brightness matrix LED assembly challenges and solutions

Abstract

Solid State Lighting is pervasive and will continue to grow in popularity as performance and costs mature. Products include camera phone flashes, televisions, display backlighting, automotive lighting, medical products, architectural lighting, projectors, and others still in development. Reaching performance and cost targets will require continuous improvements in LED devices and packaging to extract ever increasing lumens per watt. Several new products use a matrix of LED devices packaged together. These matrix LED packages present challenges for both die attach and wire bonding compared to single die packages. A brief overview of market applications and the package options is presented. A case study is presented to highlight the challenges and solutions when producing matrix LED packages. Pulsed heat eutectic die attach and wire chain bonding are explored for application to matrix LED assembly.