Mechanical properties of interconnection interfaces in micro tin-silver-copper solder joints

Abstract

Micro solder joints are common in high-end microelectronics. Their load-bearing capacity and mechanical reliability have become the key factors affecting the performance of products. Herein, the mechanical properties of different regions in the welding interface of low-silver lead-free micro joints were explored by nanoindentation tests. The results showed that the hardness, modulus and yield strength of interfacial IMC regions were higher than those of solder body region. The interfacial IMC regions also displayed better creep resistance than the body region. The research results lent support for the reliability evaluation of Sn1.0Ag0.5Cu low-silver lead-free solders.