Beyond Y2K: technology convergence as a driver of future low-voltage power management semiconductors

Abstract

Convergence of computing consumer, and communication products into multifunction portables (e.g. Internet cell phones) is driving today's electronics toward a unified chip set concept sharing common power architectures. These converging specifications allow analog and power management ICs and discretes to migrate into older mid-to-deep submicron DRAM fabs, enjoying significant chip shrinks, speed increases, switch resistance reduction, higher functionality and lower manufacturing costs. Low thermal budget processes, CMP, 3D structures, ultra-shallow junctions and planarized interconnects are promising and beneficial byproducts of this evolution. The world's first production 45 Mcell/cm/sup 2/ (287 Mcell/in/sup 2/) vertical 30 V power TrenchDMOS is illustrative of technology convergence in power management semiconductors.