RF power divider for CDMA, Bluetooth & 3G application using stepped-impedance technology

Sandeep Kumar, Mithilesh Kumar
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Abstract

A novel RF power divider for CDMA (1.8GHz), Bluetooth (2.4GHz) & 3G (2.1GHz & 2.5GHz) application using stepped-impedance technology on microstrip line is proposed in this paper. This divider is formed by installing the concept of a microstrip multi-section impedance transformer and for achieving of wideband using stub matching. Finally, a compact power divider is designed, and it is demonstrated that 9dB powers splitting from one input port to eight output ports is achieved. In addition, good impedance matching at all the three ports and excellent isolation between two output ports are obtained over the specified 1.7-2.6GHz wideband range. The simulated return loss is greater than 10 dB over the WB. The average insertion loss, and group delay are around 9dB (including the 9-dB power-dividing insertion loss) and around 0.3 ns over across the wideband. In addition, the isolations between the output ports are greater than 10 dB over the wideband.
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射频功率分配器用于CDMA,蓝牙和3G应用,采用阶跃阻抗技术
针对CDMA (1.8GHz)、蓝牙(2.4GHz)和3G (2.1GHz和2.5GHz)应用,提出了一种采用微带线阶跃阻抗技术的新型射频功率分压器。这种分压器是通过安装微带多段阻抗变压器的概念形成的,并利用存根匹配实现宽带。最后,设计了一个紧凑的功率分配器,并证明了从一个输入端口到八个输出端口可以实现9dB的功率分割。此外,在规定的1.7-2.6GHz宽带范围内,三个端口的阻抗匹配良好,两个输出端口之间具有良好的隔离性。模拟回波损耗在WB上大于10db。平均插入损耗和组延迟约为9dB(包括9dB分功率插入损耗),在整个宽带上约为0.3 ns。此外,在宽带上,输出端口之间的隔离度大于10 dB。
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