Zhi-Xia Du, Bintao Tang, Chunbing Guo, Bo Sun, Shan-jia Xu, Gary Zhang
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引用次数: 0
Abstract
A millimeter-wave multi-layer antenna-in-package design is proposed for 5G applications. A patch antenna is designed in the package with HDI stack-up based on liquid-crystal polymer (LCP). A cavity is located in the multi-layer LCP to hold the RFIC die. Moreover, the antenna is matched to the RFIC die by employing a stripline matching network with smooth transition. Simulation results show that the antenna in package achieves a reflection coefficient of −30 dB and a boresight gain greater than 6.7 dBi at 39 GHz.
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